VIP-VIRANT SMD PLACEMENT

From the sketch through the circuit diagram up to the placed SMD PCB - in the future oriented electronic production the use of SMD placed PCBs is indispencable. For this reason we equip and place our PCBs by ourself with SMD equipment of the latest generation.

With our machinery we can process all SMD from 201 to QFPs with highest precision, 0.3 mm grid and a length of the edge of 54 x 54 mm². The maximum placement area is 440 x 500 mm². The maximum soldering temperature (around 230°C) in the vapor phase guarantees a safe soldering with lead free soldering paste and has minimized thermal impact on the components. Homogeneous heat distribution is the key for safe soldering of BGA components.Therefore also other temperature problems of metal core printed boards (ALU boards, e.g. for applications of highpower LEDs) do not occur in this phase.

Our SMD spectrum overview:

• conventional SMD- and mixed placement
• automatic, half-automatic or manual placement by TEACH-In or using the CAD data
• placement of THT, SMT, Finepitch
• component sizes from 0603 to TQFP (GD 0.3mm) and  µBGA (0.5mm)
• reflow soldering with convection oven (if necessary use of nitrogen)
• functional inspection